FREMONT, Calif., Oct. 23, 2018 (GLOBE NEWSWIRE) — Aehr Analysis Systems (NASDAQ: AEHR), a accepted supplier of semiconductor analysis and burn-in equipment, today appear that it will be featuring its FOX-XPTM aing bearing multi-wafer analysis and burn-in systems for aerial aggregate accumulation and aboriginal abortion amount (EFR) analysis in berth 51 at the 15th Annual International Wafer-Level Packaging Appointment (IWLPC) demography abode October 23 – 25 in San Jose, California at the DoubleTree by Hilton Hotel San Jose.
IWLPC brings calm some of the semiconductor industry’s best admired authorities acclamation all aspects of wafer-level, 3D, TSV, and MEMS accessory packaging and manufacturing. Interconnecting Wafer-Level Packaging, 3D Packaging, and Advanced Accomplishment and Test, the International Wafer-Level Packaging Appointment is at the beginning of the packaging technology evolution. The Wafer-Level Packaging (WLP) clue appearance sessions on amalgamation reliability, affiliation technology, wafer-level fan-out action and metrology, and panel-level fan-out packaging. The Advanced Accomplishment clue appearance sessions on analysis & test, new methods & materials, and action and technology.
Aehr Analysis President and CEO Gayn Erickson commented, “Aehr Analysis food complete analysis and burn-in solutions for believability screening and accumulation of WLP accessories to ensure that the accessories accommodated their believability targets, which is the amount of this conference. As added new artefact designs claiming acceptable analysis and believability screening methodologies, Aehr’s wafer-level and singulated die/module accumulation analysis and burn-in capabilities action a cost-effective band-aid for aerial aggregate production. Reliability-critical applications accommodate automotive agent ascendancy and sensor systems, sensors and aegis accessories in adaptable smartphones and tablets, and an absolute new charge for believability and affirmation of operation in wearable biosensors.”
The band-aid Aehr Analysis will affection at its IWLPC display berth is the FOX-XP system, the company’s next-generation multi-wafer and now singulated die/module analysis solution. The FOX-XP arrangement is able of anatomic analysis and burn-in/cycling of WLP articles including beam memories, microcontrollers, sensors, and added leading-edge ICs in dent or multi-die console form. The FOX wafer-level systems advance Aehr Test’s FOX WaferPakTM Contactors, which accommodate cost-effective solutions for authoritative electrical acquaintance with a abounding dent or substrate in a multi-wafer or multi-panel environment. The latest agreement with DiePak® Carriers additionally enables burn-in of singulated WLP die and multi-die modules to awning for defects in both the die and the WLP accumulation process. The consistent known-good die, multi-die or stacked-die packaged genitalia can again be acclimated for aerial believability and affection applications such as action solid accompaniment drives, automotive devices, awful admired adaptable applications, and mission analytical chip circuits and sensors.
The key affection of the FOX-XP analysis corpuscle that contributes to its cost-effectiveness is the adeptness to accommodate up to 2,048 “Universal Channels” per dent or DiePak carrier, enabling the arrangement to analysis all the accessories on the dent or DiePak Carrier in parallel. The avant-garde “Universal Channel” architectonics allows any approach to accomplish any action (I/O, Accessory Adeptness Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)). This added architectonics allows barter to accomplish per pin parametric testing, added all-encompassing agenda arrangement analysis with added abstracts bang / abduction anamnesis (32M per pin), and added browse (768M) optimized for BIST/DFT testing.
A distinct FOX-XP analysis arrangement may be configured with up to 18 slots of analysis assets enabling up to 18 WaferPak Contactors or DiePak Carriers to be activated simultaneously. The FOX-XP arrangement additionally offers per aperture aerial achievement thermal chucks to administer the temperature of the aerial adeptness body accessories beneath test. The brand of an 18-slot FOX-XP arrangement is agnate to the brand of archetypal semiconductor Automatic Analysis Accessories (ATE) that can alone analysis one dent at a time.
With the accomplished dent throughput accessible in the ATE industry, the adaptability of Aehr Test’s new “Universal Channel” architecture, and the adeptness to accomplish both anatomic arrangement analysis and parametric testing at full-wafer alongside test, the FOX-XP arrangement provides a awful differentiated band-aid for believability abilities and accumulation burn-in of WLP accessories to ensure the accumulation of awful reliable devices.
About Aehr Analysis SystemsHeadquartered in Fremont, California, Aehr Analysis Systems is a accepted provider of analysis systems for burning-in and testing logic, optical and anamnesis chip circuits and has over 2,500 systems installed worldwide. Increased affection and believability needs of the Automotive and Mobility chip ambit markets are active added analysis requirements, incremental accommodation needs, and new opportunities for Aehr Analysis articles in package, dent level, and singulated die/module akin test. Aehr Analysis has developed and alien several avant-garde products, including the ABTSTM and FOX-PTM families of analysis and burn-in systems and FOX WaferPakTM Aligner, FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The ABTS arrangement is acclimated in accumulation and accomplishment testing of packaged genitalia for both lower adeptness and college adeptness argumentation accessories as able-bodied as all accepted types of anamnesis devices. The FOX-XP arrangement is a abounding dent acquaintance and singulated die/module analysis and burn-in arrangement acclimated for burn-in and anatomic analysis of circuitous devices, such as leading-edge memories, agenda arresting processors, microprocessors, microcontrollers, systems-on-a-chip, and chip optical devices. The WaferPak contactor contains a different abounding dent delving agenda able of testing wafers up to 300mm that enables IC manufacturers to accomplish analysis and burn-in of abounding wafers on Aehr Analysis FOX systems. The DiePak Carrier is a reusable, acting amalgamation that enables IC manufacturers to accomplish cost-effective final analysis and burn-in of both bald die and modules. For added information, amuse appointment Aehr Analysis Systems’ website at www.aehr.com.
Contacts:Aehr Analysis Systems Carl Buck V.P of Marketing (510) 623-9400 x381 [email protected]
MKR Group Inc.Todd Kehrli or Jim ByersAnalyst/Investor Contact(323) [email protected]
Electrical Test Forms Is So Famous, But Why? | Electrical Test Forms – electrical test forms
| Encouraged in order to my personal website, on this moment I’ll provide you with about electrical test forms